The problem
Printed and flexible electronics promise cheap, high-volume devices — but makers cannot verify layer quality (conductivity, ink spread, thickness) while printing, so defects surface after the fact as scrap, rework, and wasted material.
How it works
TRAQC’s system bolts onto existing lines — roll-to-roll, sheet-to-sheet, or tabletop, any printing method — and scans layers contact-free at production speed. Terahertz sensing plus AI models flag characteristic defects inline, aiming for sustainable high-volume operation with less waste.
Pain points
Batches scrapped after full production runs, offline spot-checks too slow to catch drift, and material waste that kills the economics of scaling printed electronics.
Business model
A product-and-integration play: the TRAQC System installed on manufacturers’ lines, developed with industrial partners through pilots and collaborations such as the 2025 AlmaScience partnership. Pricing is undisclosed.
Challenges
Selling deep-tech hardware into factories means long pilot cycles and line-by-line integration work; the team is still small and pre-institutional funding, carried by accelerator programs (McGill Dobson, CDL), awards attention, and partnership grants.
Funding
- Raised: MISSING (no institutional round disclosed; programs, pilots, and partnership support only).
- Valuation: MISSING.
- Status: idea — early-stage bet emerging from 2021 PhD research.
Latest — June 2025
TRAQC partnered with AlmaScience in Portugal to advance quality control in printed electronics, an international collaboration supported by EMERGE — following a May 2025 shortlist for the inaugural Photonics Frontiers Award.